◆All operations are easy ａnd using Windows interface in Chinese/English version.

◆Survey thickness of tin solder by auto matica lly or manually.

◆Survey the length ａnd width manually,and the gap of tin solder.

◆Calculate the measure of area, the measure of cross-section ａnd the measure of volumn automatically.

◆All surveyed values can be recorded to a file ａnd be printed to a report.

◆Provide the diagrams of thickness distribution ａnd control diagrams of X_BAR_R.

◆Calculate man facture ability degree automatically（CP, CPK, CPM）

◆It can have proprietary record according to every different production ling.

◆It can adjust focus point in different thickness of PC boards.

◆It can be called to sample periodically.

 

 

适用（APPLECATION）

 

◆各式厚度量测数值取得统计分析

◆锡膏印刷机制程品管检查

◆锡膏印刷厚度良性测量

◆锡膏印刷成型，尺寸量测检查

◆提供其他物品测厚，测长，量测检查

◆Get the results of statistics ａnd analysis about all surveyed values in every thickness degree.

◆Inspect the quality of solder printing process.

◆Survey the thickness benignancy of tin solder

◆Measure the dimension of tin solder

◆Provide thickness ａnd dimension measurement function for other objects

 

 

功能（FUNCTION）

 

◆量测印刷锡膏厚度、长度、高度、间距。

◆提供厚度分布数值参考。

◆提供各种统计分析图表

 

 X管制图、 R管制图、厚度列表

 X平均值管制图 单点列表

◆Surveying the thickness of printing tin solder, length ,height ａnd interval.

◆Provide the references of thickness distribution values.

◆Provide the analysis of different measure of cross-section.

◆Calculate the measure of area ａnd volumn automatically in object which to be surveyed.

◆Provide all diagrams of statistics ａnd analysis.

 Provide X control Diagram, R Control Diagram

 and Thickness List Diagram. Provide X Average

 Control Diagram, Single Point List Diagram.