产品介绍
PolishCheck (Tropel可缝合平坦度检测仪)
价 格：￥价格合理，欢迎洽谈！
型 号：
产品完善度：
生产地：其他访问量：348次
发布日期：2009/11/2 0:00:00
更新日期：1900/1/1 0:00:00
详细内容
Principle/原理:Grazing incidence Interferometer/斜入射干涉
Accuracy/精度:0.05-0.5μm（不同参数不同精度）
Resolution/解析度:0.01μm/0.1微米
Part Size/尺寸范围:12mm-595mm/12毫米-595毫米
Dynamic Range/动态测量范围:50μm/50微米
Data Point/数据点:Up to 250,000/达250,000以上
Measurement Time/测量时间:45s/45秒
Standard Measurements/标准测量:Flatness/Line profile/Spherical radius
Data Analysis/数据分析:3D,topographic,yield,distribution
X,Y,circular and radial slice
Flat,spherical,and conical fit data
Wafer Global:
Front Referenced:TIR,FPD,NTD,SLICE
Back Referenced:TTV,TAPER,SLICE
Wafer Site:
Front Referenced:LTIR,LFPD
Back Referenced:LTV,LDOF
Block:BlockCheck,Whole Block Reconstruction,Block Slice,Block Segment
Accuracy/精度:0.05-0.5μm（不同参数不同精度）
Resolution/解析度:0.01μm/0.1微米
Part Size/尺寸范围:12mm-595mm/12毫米-595毫米
Dynamic Range/动态测量范围:50μm/50微米
Data Point/数据点:Up to 250,000/达250,000以上
Measurement Time/测量时间:45s/45秒
Standard Measurements/标准测量:Flatness/Line profile/Spherical radius
Data Analysis/数据分析:3D,topographic,yield,distribution
X,Y,circular and radial slice
Flat,spherical,and conical fit data
Wafer Global:
Front Referenced:TIR,FPD,NTD,SLICE
Back Referenced:TTV,TAPER,SLICE
Wafer Site:
Front Referenced:LTIR,LFPD
Back Referenced:LTV,LDOF
Block:BlockCheck,Whole Block Reconstruction,Block Slice,Block Segment
